Hybrid Bonding Videos

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The Future of 3D Chip Architecture is Here

January 22, 2025

Adeia’s hybrid bonding technology is revolutionizing chip design and manufacturing with ultra-fine pitch, low-inductance, low-capacitance, and low-resistance interconnects. Setting new standards for efficiency and reliability.

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Ideas to Innovations

March 14, 2023

Adeia’s 30 years of semiconductor research and development is enabling innovations in chip scale packaging, delivering smaller, faster, denser interconnects for enhanced data transfer.

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Hybrid Bonding: Greater Functionality, Higher Performance & Smaller Size

November 8, 2022

In this webinar, you’ll learn how hybrid bonding technology enables small-footprint heterogeneous integration while increasing efficiency, performance, and reliability.

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Adeia Semiconductor Hybrid Bonding Technologies: Wafer-to-Wafer Bonding

October 5, 2022

Watch this demonstration of low-temperature wafer-to-wafer hybrid bonding that enables fine pitch 3D electrical interconnects.

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Adeia Semiconductor Hybrid Bonding Technologies: Die-to-Wafer Bonding

October 5, 2022

See how Adeia’s demonstration of die-to-wafer hybrid bonding eliminates the need for copper pillars and underfill while resulting in dramatically thinner stacks.

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Adeia Semiconductor Hybrid Bonding Technologies: DBI® Ultra

October 5, 2022

DBI® Ultra hybrid bonding enables high-bandwidth and high-performance computing with 2.5D, 3D, and 3.5D integration of logic and memory applications including HBM, CPU, GPU, FPGA, or SoC.

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