Cookie Preferences
DBI® Ultra is a cutting-edge, low-temperature hybrid bonding technology platform designed for die-to-wafer and die-to-die stacking. It enables seamless integration of dies of any size, across diverse technology nodes, wafer sizes, and materials, delivering unmatched flexibility for advanced semiconductor designs. Optimized for heterogeneous integration, DBI® Ultra supports 2.5D, 3D, and 3.5D architectures, making it ideal for high-performance compute products including HBM, CPUs, GPUs, and TPUs. By eliminating traditional interconnect limitations, DBI® Ultra enhances performance, power efficiency, and density, shaping the future of semiconductor innovation.
%202.png)
%208.png)
%2010.png)
%2011.png)
%202.png)
DBI® Ultra Die-to-Wafer Hybrid Bonding
Adeia's hybrid bonding technology is transforming semiconductor architecture and manufacturing through its universal hybrid bond interconnect approach. The hybrid bond interconnect achieves sub-micron pitch scaling while delivering lower capacitance, inductance, and resistance compared to traditional solder micro-bumps. This enables seamless integration of chips with diverse functionalities manufactured at different process nodes and fabs, advancing 2.5D, 3D, and 3.5D chiplet architectures. The technology provides system architects with enhanced design flexibility to innovate their product roadmaps and extend the benefits of Moore's Law scaling.
%20(1).png){kind=small}
%20(2).png){kind=small}
© 2025 Adeia Inc. All Rights Reserved |
Terms & Conditions |
Privacy Policy |
Accessibility
