Adeia Blog

All Blogs

December 4, 2025

MicroLED Breakthroughs: Paving the Way for Scalable, Cost-Effective AR Smart Glasses

MicroLED Breakthroughs: Paving the Way for Scalable, Cost-Effective AR Smart Glasses

MicroLED technology is emerging as a pivotal innovation for augmented reality (AR) smart glasses, offering the potential for brighter displays, improved energy efficiency, and enhanced visual experiences. However, the path to widespread adoption is hindered by challenges in manufacturability and cost, primarily due to an underdeveloped supply chain. To overcome these obstacles, industry leaders are exploring advanced fabrication techniques and integration strategies that leverage existing semiconductor manufacturing ecosystems.​

The Promise and Challenges of MicroLEDs in AR

AR smart glasses require displays that are not only compact but also capable of high brightness and resolution to function effectively in various lighting conditions. MicroLEDs, with their self-emissive properties, high luminance, and potential for miniaturization, are well-suited for this application. Despite these advantages, the transition from prototype to mass production has been slow. The primary hurdles include the difficulty of producing ultra-fine gallium nitride (GaN) pixels smaller than 10 micrometers and integrating them with miniaturized silicon-based backplane circuits. These challenges are further exacerbated by the need for heterogeneous integration within the compact confines of wearable devices.​

Innovative Strategies for Cost Reduction

To address these challenges, researchers at Adeia are pursuing two key strategies:

  1. Monolithic Fabrication on 300 mm Silicon Wafers: Producing ultra-fine-pitch GaN red, green, and blue (RGB) diodes directly on 300 mm silicon wafers can significantly reduce the cost per LED. This approach benefits from the mature infrastructure of 300 mm silicon wafer processing, allowing manufacturers to utilize existing tools and facilities.
  2. Efficient Frontplane-to-Backplane Integration: Integrating the MicroLED frontplane with the silicon backplane can be achieved through wafer-to-wafer or die-to-wafer bonding techniques. These methods enhance alignment accuracy and electrical performance while potentially lowering costs. Advancements in 3D heterogeneous integration, such as hybrid bonding, play a crucial role in this process by enabling strong, precise connections between different material layers.

Leveraging the Existing Semiconductor Ecosystem

By aligning MicroLED fabrication with established semiconductor processes, manufacturers can capitalize on the existing 300 mm high-volume silicon manufacturing ecosystem. This alignment facilitates the adoption of high-performance, low-power complementary metal-oxide-semiconductor (CMOS) backplane designs, which are essential for the functionality of AR displays. ​

The Aim Toward Scalable and Cost-Effective Production

The convergence of these strategies aims to establish a scalable and cost-effective production pathway for MicroLEDs in AR smart glasses. By leveraging the mature silicon manufacturing infrastructure and adopting advanced integration techniques, the industry can accelerate the commercialization of MicroLED displays. This progress is essential for meeting the growing demand for next-generation AR applications, where display performance and device affordability are critical to widespread adoption.​

The future of AR smart glasses is closely tied to advancements in MicroLED technology. Adeia’s expertise in semiconductor integration and hybrid bonding is accelerating this shift, enabling high-performance, low-power MicroLED displays that help pave the way for affordable, next-generation AR solutions that transform user experiences.

Industry Perspective: Streaming Technology Evolution

Revolutionizing Live Streaming: Real-Time Object Replacement for Interactive Experiences

The Future of Faster, Smaller, and More Efficient Chips: A Breakthrough in Hybrid Bonding

The Evolution of Virtual Try-On Technology: Transforming Digital Retail

Dr. Seung Kang

Vice President, Semiconductor Technology

Dr. Seung Kang is Vice President of Semiconductor Strategy at Adeia, where he leads strategic programs that include semiconductor technology, design and system co-optimization. He also oversees the strategy and development of scalable, cost-efficient semiconductor solutions for microLED displays, an emerging power-efficient technology that could replace today’s LED and OLED displays. Prior to Adeia, Dr. Kang was globally recognized for pioneering and directing the Advanced Memory Program at Qualcomm Technologies, Inc., driving early R&D and IP validation across the semiconductor ecosystem. Before Qualcomm, he worked at Lucent Technologies Bell Laboratories and Lawrence Berkeley National Laboratory. Dr. Kang obtained a Ph.D. degree from the University of California at Berkeley and B.S. and M.S. degrees from Seoul National University, Korea. He is a prolific inventor with 250 U.S. patents and over 1000 global patents, and he has made significant contributions to the field with over 100 published papers.