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June 11, 2024
At Adeia Inc., we're thrilled to share the highlights of an exciting and productive 2024. As a leading R&D company, we are dedicated to driving innovation in the semiconductor technology sector. This year, our advancements and partnerships have solidified our position at the forefront of these industries.
One of our most significant achievements in 2024 stems from the long-term agreements we secured in 2023 with Kioxia Corporation and Western Digital. These world leaders in flash memory and solid-state drives have licensed Adeia’s semiconductor patent portfolio, including our groundbreaking hybrid bonding technology.
Hybrid bonding is an advanced semiconductor packaging technology that integrates various functional elements—such as logic, memory, and sensors—into compact, high-performance systems. Using the direct bond interconnect (DBI®) process, this technology connects different semiconductor components, significantly enhancing electrical and thermal performance.
In early 2024, our semiconductor team showcased their expertise at prominent industry events:
Our team’s knowledge continues to be a valuable resource for the industry. Laura Mirkarimi, our Senior Vice President and Head of SEMI Engineering, has been sought after for her insights in interviews with 3DinCities and in the forthcoming book, Hybrid Bonding: The Time has Come.
We are proud to announce that our semiconductor team received the “Best Session Paper” award at ECTC 2023 for their article, “Fine Pitch Die-to-Wafer Hybrid Bonding.” This recognition underscores our commitment to advancing hybrid bonding technology and addressing yield loss mechanisms.
Adeia’s consistent innovation and strategic partnerships are shaping the future of semiconductor technology. As we continue to push the boundaries of what’s possible, we remain dedicated to enhancing experiences for consumers around the world.
Stay tuned for more exciting updates!
Laura Mirkarimi is SVP, Head of Semi Engineering at Adeia Semiconductor, San Jose, California. She earned a PhD in Materials Science & Eng. at Northwestern University and a B.S. in Ceramic Science & Eng. from Pennsylvania State University. Dr. Mirkarimi leads the 3D Technology Team at Adeia and develops technology in hybrid bonding, advanced packaging and thermal management for future generations of electronic products. She authored/coauthored over 100 granted patents and has 60 technical publications. Prior to joining Adeia, she developed electronic devices including ferroelectric memory, transparent conductors and photonic crystal sensors at Hewlett Packard Laboratories for 12 years. As VP of Electronics Segment Marketing at Zeiss Microsopy, she worked with the R&D and Product Manufacturing teams to build the product roadmap for x-ray microscopy.
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